The development of mobile technology is moving very fast. And, one of which is supported by the availability of a reliable chipset. Qualcomm, as one of the chipset manufacturers have recently announced that its Gobi modem chipset their latest generation, MDM8225, MDM9225 and MDM9625, ready to be tested by carriers and handset manufacturers in the fourth quarter of 2012.
The new chipset will be the first to support HSPA mobile broadband standard +10 and next-generation LTE, LTE Advanced. Additionally, MDM9225 and MDM9625 will support LTE provider to service provider 150 Mbps speeds. Interestingly, the Gobi chipset made ??with 28nm architecture, which will feature improved performance and saving in power consumption.
The new chip is first mentioned as an integrating seven different radio access modes on a single baseband chip: CDMA2000 (1X, DO), GSM / EDGE, UMTS (WCDMA, TD-SCDMA) and LTE (LTE-FDD and both LTE-TDD). It will enable OEMs to design mobile devices that can operate at a variety of networks and configurations that are used throughout the world.
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